3M™ 5589H-1.5 is a thermally conductive, soft acrylic interface pad, designed to provide a preferential heat transfer path away from heat generating components. Because of its softness, the interface pad can decrease the load to integrated circuit chips during compression. It offers good softness and conformability to non-flat surfaces and excellent compressive stress relaxation.
5589H-1.5 also has high thermal conductivity, good surface tack and good dielectric performance. It offers excellent durability for long term thermal conductivity and electric insulation stability.
5589H is available in non-standard slit rolls, sheets and custom shapes. For more information, please contact us.
