Our range of high performance phase change thermal interface materials are designed to meet the thermal and reliability requirements of today’s electronics.
Phase change thermal materials are solid pads at room temperature. At temperatures above their transition temperature, they begin to soften and flow, filling the microscopic irregularities of the components it contacts. The result is an interface with minimal thermal contact resistance. Due to the gradual change in viscosity (softening), migration (pump out) is minimised. They provide superior surface wetting, minimum bondline thickness and actively expel entrapped air.
Phase change materials are used in a variety of applications, including microprocessors, power components and modules and chip sets.
Phase change thermal interface material characteristics:
Browse through our range of phase change materials below for more detailed information and product data sheets. If you would like to ask us a question about any of these products, simply click on “add to wish list” and the product details can be added to a contact form once you’re ready to get in touch. You can also send these details to yourself or a colleague.
Any data provided relates to values typically generated when measuring these materials, and is offered as a guide to material selection. However it is not guaranteed and the user is responsible for evaluating the suitability of a product for the application it is intended for. Some test methods may vary, please refer to data sheet or call for assistance.
|Title||Stock status||Adhesive||Carrier||Colour||Dielectric strength (kV/mm)||Manufacturer / SOS||Max length (m)||Max. short temp (˚C)||Max width (cm)||Shore Hardness (00)||Thermal conductivity (W/m-K)||Thermal impedance (˚C-cm²/W)||Thickness (mm)|
|HeatSORB™ HA-CP-43030-TS8||3||Acrylic||PU||Black||21-30||Rogers||91.4||137.2||No data||0.14||No data||0.3|
|Laird Tpcm™ 583||3||None||Non-reinforced film||Grey||Laird||3.8||0.013||0.08|
|Laird Tpcm™ 585||3||None||Non-reinforced film||Grey||Laird||3.8||0.013||0.13|
|Laird Tpcm™ 588||3||None||Non-reinforced film||Grey||Laird||3.8||0.013||0.2|
|Laird Tpcm™ 5810||3||None||Non-reinforced film||Grey||Laird||3.8||0.013||0.25|
|Laird Tpcm™ 5816||3||None||Non-reinforced film||Grey||Laird||3.8||0.013||0.41|
Browse our previous projects to find relevant, real-life examples of the powerful problem solving capabilities of our thermal phase change materials. Browse all case studies to learn more about custom die-cut components and our tape converting capabilities.
Utilising the latest converting technologies, we can customise phase change materials to create non-standard roll widths and lengths, or convenient and easy to handle components. Customising your material offers a number of benefits, including cost savings and enhanced product design. Whatever your needs, we have the experience and capabilities to provide a complete solution, from design and prototyping to full production and automated assembly.
To learn more about our phase change thermal interface materials and their uses, browse through our range of interesting and relevant videos, news and other media.