Thermal management materials

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  • About thermal interface materials

    The trend for smaller and more powerful electronics leads to increasingly complex thermal conductivity challenges for systems designers. Using thermal interface materials (TIMs), the heat from hot components can be transferred to a cold surface or cooling hardware by means of low thermal resistance and high thermal conductivity combinations.

    A variety of technologies and constructions ensure the most efficient thermal conductivity solution is available, whatever your thermal conductivity needs. Browse the different types of thermal interface material below, including tape, gap pad, phase change and electrically conductive thermal interface materials.  


  • Search thermal interface materials

    Browse thermal interface materials below for more detailed information and product data sheets. For more information, please contact us.


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    • Adhesive
    • Carrier
    • Colour
    • Thickness (mm)
    • Max. short temp (˚C)
    • Thermal conductivity (W/m-K)
    • Shore Hardness (00)
    • Dielectric strength (kV/mm)
    • Thermal impedance (˚C-cm²/W)
    • Max width (cm)
    • Max length (m)
    • Stock status
    • Manufacturer / SOS
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    • Thickness range (mm)

    • Temp. range (˚C)

    • Thermal cond. range (W/m-K)

    • Dielectric strength (kV/mm)

    • Adhesive

    • Carrier

    • Colour

    • Max width (cm)

    • Max length (m)

    • Stock status

    • Manufacturer / SOS

    • Thermal imp. range (˚C-cm²/W)

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    Any data provided relates to values typically generated when measuring these materials, and is offered as a guide to material selection. However it is not guaranteed and the user is responsible for evaluating the suitability of a product for the application it is intended for. Some test methods may vary, please refer to data sheet or call for assistance.

    Title Stock status Adhesive Carrier Colour Dielectric strength (kV/mm) Manufacturer / SOS Max length (m) Max. short temp (˚C) Max width (cm) Shore Hardness (00) Thermal conductivity (W/m-K) Thermal impedance (˚C-cm²/W) Thickness (mm)
    Laird Tpcm™ 583 Laird Tpcm™ 583 3 None Non-reinforced film Grey Laird 3.8 0.013 0.08
    3M™ 5516 3M™ 5516 1 None Filled silicone polymer‎ Grey 11-20 3M™ 50 3.1 3.4 1
    Laird Tpcm™ 585 Laird Tpcm™ 585 3 None Non-reinforced film Grey Laird 3.8 0.013 0.13
    3M™ 5590H-1.0 3M™ 5590H-1.0 3 None Filled acrylic polymer Light grey 31-40 3M™ 60 3 4.5 1
    Laird Tpcm™ 588 Laird Tpcm™ 588 3 None Non-reinforced film Grey Laird 3.8 0.013 0.2
    3M™ 8810 3M™ 8810 1 Acrylic Filled acrylic polymer White 21-30 3M™ N/A 0.6 5.7 0.25
    Laird Tpcm™ 5810 Laird Tpcm™ 5810 3 None Non-reinforced film Grey Laird 3.8 0.013 0.25
    3M™ 5590H-1.5 3M™ 5590H-1.5 3 None Filled acrylic polymer Light grey 31-40 3M™ 60 3 6.1 1.5
    Laird Tpcm™ 5816 Laird Tpcm™ 5816 3 None Non-reinforced film Grey