The trend for smaller and more powerful electronics leads to increasingly complex thermal conductivity challenges for systems designers. Using thermal interface materials (TIMs), the heat from hot components can be transferred to a cold surface or cooling hardware by means of low thermal resistance and high thermal conductivity combinations.
A variety of technologies and constructions ensure the most efficient thermal conductivity solution is available, whatever your thermal conductivity needs. Browse the different types of thermal interface material below, including tape, gap pad, phase change and electrically conductive thermal interface materials.
Any data provided relates to values typically generated when measuring these materials, and is offered as a guide to material selection. However it is not guaranteed and the user is responsible for evaluating the suitability of a product for the application it is intended for. Some test methods may vary, please refer to data sheet or call for assistance.
|Title||Stock status||Adhesive||Carrier||Colour||Dielectric strength (kV/mm)||Manufacturer / SOS||Max length (m)||Max. short temp (˚C)||Max width (cm)||Shore Hardness (00)||Thermal conductivity (W/m-K)||Thermal impedance (˚C-cm²/W)||Thickness (mm)|
|Laird Tpcm™ 583||3||None||Non-reinforced film||Grey||Laird||3.8||0.013||0.08|
|3M™ 5516||1||None||Filled silicone polymer||Grey||11-20||3M™||50||3.1||3.4||1|
|Laird Tpcm™ 585||3||None||Non-reinforced film||Grey||Laird||3.8||0.013||0.13|
|3M™ 5590H-1.0||3||None||Filled acrylic polymer||Light grey||31-40||3M™||60||3||4.5||1|
|Laird Tpcm™ 588||3||None||Non-reinforced film||Grey||Laird||3.8||0.013||0.2|
|3M™ 8810||1||Acrylic||Filled acrylic polymer||White||21-30||3M™||N/A||0.6||5.7||0.25|
|Laird Tpcm™ 5810||3||None||Non-reinforced film||Grey||Laird||3.8||0.013||0.25|
|3M™ 5590H-1.5||3||None||Filled acrylic polymer||Light grey||31-40||3M™||60||3||6.1||1.5|
|Laird Tpcm™ 5816||3||None||Non-reinforced film||Grey|