3M™ 5590H-1.5 is a thermally conductive, acrylic interface pad, designed to provide a preferential heat transfer path away from heat generating components. Because of its softness, the interface pad can decrease the load to integrated circuit chips during compression.
This product provides good tack to many surfaces and offers good softness, conformability and dielectric performance. It has excellent compressive stress relaxation and high thermal conductivity.
5590H-1.5 also offers excellent durability for long term thermal conductivity and electric insulation stability. It is available in sheets and custom shapes. For more information, please contact us.
