
Laird BMIC-001
Overview for Laird BMIC-001
Laird BMIC-001 spring contact grounds and carries current and signals and interconnects boards and devices. This product consists of 0.1mm beryllium copper and is part of Laird’s surface mount technology contacts and clips range, which also offers spring contacts in tin, nickel and gold plating options to allow for the maximum electrical current carrying performance.
For more information, please contact us.

Product features for Laird BMIC-001
Adhesive |
None |
Carrier |
Beryllium copper |
Colour |
Copper |
Thickness (mm) |
No data |
Min. temp (˚C) |
No data |
Max. short temp (˚C) |
121 |
Manufacturer / SOS |
Laird |
Shielding Effectiveness @GHz(dB) |
No data |
Electrical resistance (Ω) |
N/A |
Make an enquiry
"*" indicates required fields
Post Count :: 0
MAN: laird
CAR: beryllium-copper
ADH: none
THI:
GRO: Array
(
[0] => 4742
[1] => 4763
)
RPC: 0
RPR: Array
(
)