
Laird Tgon™ 805
Overview for Laird Tgon™ 805
Laird Tgon™ 805 is a 0.13mm thick, electrically and thermally conductive interface pad. It is used where electrical isolation is not required and is ideal for where electrical contact and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis. This product is >98% graphite and offers low thermal resistance. Tgon™ 805 is available with or without an adhesive and comes in sheet or custom shapes.
Download: laird-tgon-800-series-tgon-805-parafix

Product features for Laird Tgon™ 805
Adhesive |
None |
Carrier |
Flexible graphite |
Colour |
Pewter |
Thickness (mm) |
0.13 |
Min. temp (˚C) |
-240 |
Max. short temp (˚C) |
300 |
Shore Hardness (00) |
85 |
Manufacturer / SOS |
Laird |
Thermal conductivity (W/m-K) |
5 |
Dielectric strength (kV/mm) |
No data |
Thermal impedance (˚C-cm²/W) |
0.42 |
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