Laird Tgon™ 820

Laird Tgon™ 820

Overview for Laird Tgon™ 820

Laird Tgon™ 820 is a 0.51mm thick, electrically and thermally conductive interface pad. It is used where electrical isolation is not required and is ideal for where electrical contact and thermal transfer are desired. Its unique grain-oriented, plate-like structure provides a high thermal conductivity of 240 W/mK in the XY plane and 5 W/mK through the z-axis. This product is >98% graphite and offers low thermal resistance.

Tgon™ 820 is available with or without an adhesive and comes in sheet or custom shapes.

For more information, please contact us.

Laird Tgon™ 820

Product features for Laird Tgon™ 820



Adhesive

None


Carrier

Flexible graphite


Colour

Pewter


Thickness (mm)

0.51


Min. temp (˚C)

-240


Max. short temp (˚C)

300


Manufacturer / SOS

Laird


Thermal conductivity (W/m-K)

5


Dielectric strength (kV/mm)

No data


Thermal impedance (˚C-cm²/W)

1.07

Make an enquiry

"*" indicates required fields

This field is for validation purposes and should be left unchanged.
Name*
                                Post Count :: 0
MAN: laird
CAR: flexible-graphite
ADH: none
THI: 0-51-1
GRO: Array ( [0] => 4776 [1] => 4749 )
RPC: 0
RPR: Array ( )