Laird Tpcm™ 585

Overview for Laird Tpcm™ 585

Laird Tpcm™ 585 is a high-performance thermal phase change material (PCM) designed to meet the thermal reliability and price requirements of high-end thermal applications. It is a non-reinforced film with a phase change softening temperature of 50°C. At temperatures above its transition temperature, Tpcm™ 585 begins to soften and flow, filling the microscopic irregularities of the components it comes into contact with. The result is an interface with minimal thermal contact resistance. Due to the gradual change in viscosity (softening), it minimises migration (pump-out).

This product is inherently tacky, flexible and exceptionally easy-to-use. Tpcm™ 585 is reliable, offers low total thermal resistance and meets all environmental requirements including RoHS. Common applications include microprocessors, chipsets, graphic processing chips and custom ASICS.

Tpcm™ 585 is available in custom roll widths, sheets or die-cut shapes. For more information, please contact us.

Laird Tpcm™ 585

Product features for Laird Tpcm™ 585

Adhesive

None

Carrier

Non-reinforced film

Colour

Grey

Thickness (mm)

0.13

Min. temp (˚C)

-40

Max. short temp (˚C)

125

Manufacturer / SOS

Laird

Thermal conductivity (W/m-K)

3.8

Dielectric strength (kV/mm)

No data

Thermal impedance (˚C-cm²/W)

0.013

Make an enquiry

"*" indicates required fields

Name*
This field is for validation purposes and should be left unchanged.